Abstract: A finite-element analysis model of ball grid array (BGA) solder joints for microfluidic ceramic substrates was established, and fluid-structure-coupled finite-element simulation analysis was ...
Winter will be here before you know it, which means the best time to prepare for cold weather and potential snowstorms is now. While snowfall isn't as regular in many parts of the country as it used ...
Abstract: In this article, the random vibration test and finite-element simulation analysis of SAC305 solder joints in BGA packaged electronic chips were carried out. A failure model for BGA solder ...
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