Nvidia is experiencing a perfect storm of positive catalysts, including strong demand for AI accelerators and upcoming ...

TSMC is rumored to build new CoWoS advanced packaging plants in the US and Japan due to 'persistently strong demand'. TSMC to ...

To put this in context, as we reported last week, Nvidia just surpassed Apple and Microsoft in terms of market cap - that ...

The AI chip maker is benefiting from the marketwide upturn following the U.S. presidential election. TSMC's monthly sales ...

Both TSMC and NVIDIA are ramping up production capacity to meet skyrocketing demand for AI chips, with TSMC doubling its ...

TSMC's 5nm and 3nm production lines are 'fully loaded' until 1H 2025 due to 'strong orders' for AI chips, Qualcomm + MediaTek ...

Tom’s Guide reports that while Intel Xeon processors have traditionally powered a lot of servers, AMD’s EPYC lineup is ...

TSMC saw its monthly revenue top NT$300 billion (approx. US$9.4 billion) for the first time in October 2024, driven by a rise ...

Emerging advanced semiconductor packaging technologies, such as 2.5D and 3D hybrid bonding, are crucial for enhancing system ...

Advanced Micro Devices, Inc. is still working to tap into the big AI chip opportunity. Click here to read why AMD stock is a ...

Nov 7 (Reuters) - Shares of Nvidia (NVDA.O), opens new tab rallied to a record high on Thursday, making the chipmaker the first company in history to surpass a stock market value of $3.6 trillion ...

Wah Lee Industrial Corporation has successfully integrated its CoWoS packaging materials into the supply chain of leading semiconductor manufacturers. Shipments are expected to increase in 2025.