TSMC is rumored to build new CoWoS advanced packaging plants in the US and Japan due to 'persistently strong demand'. TSMC to ...

To put this in context, as we reported last week, Nvidia just surpassed Apple and Microsoft in terms of market cap - that ...

The AI chip maker is benefiting from the marketwide upturn following the U.S. presidential election. TSMC's monthly sales ...

Nvidia has rebranded its flagship Blackwell Ultra products, in what appears to be a strategic shift at the chipmaker aimed at ...

to CoWoS-Long (CoWoS-L) process starting in the fourth quarter of 2025 due to the mass production of Nvidia's Blackwell series GPUs, making CoWoS-L the primary process for TSMC's CoWoS technology.

TSMC's solid results bode well for one of its largest customers, which currently dominates the market for AI chips.

Nvidia's graphics processing units (GPUs ... Taiwan Semiconductor looks to be ahead of schedule in its efforts to increase CoWoS packaging capacity to 80,000 wafers per month.

Nvidia has successfully fixed a design flaw ... These chips employ TSMC's CoWoS-L packaging, which utilizes an RDL interposer with local silicon interconnect bridges to achieve data transfer ...

Nvidia aims to release a new chip architecture annually instead of the previous two-year cycle to sustain its dominance in AI chips, while TSMC struggles to scale its CoWoS capacity quickly enough ...